Oliver Brand

Gary K. Fedder

Christofer Hierold

Jan G. Korvink

Osamu Tabata

Henry Baltes

Detlef Löhe

Jürgen Hausselt

Microstructures, electronics, nanotechnology - these vast fields of research are growing together as the size gap narrows and many different materials are combined. Current research, engineering sucesses and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from the atomic level right up to the visible world without any gaps. In this volume, authors from three major competence centres for microengineering illustrate step by step the process from designing and simulating microcomponents of metallic and ceramic materials to replicating micro-scale components by injection molding.

Design, Tooling, and Injection Molding

Microengineering of Metals and Ceramics, Part I

Jürgen Hausselt

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