Sheng Liu

Christopher Holloway

Igal Brener

Isabelle Staude

Jason Valentine

Dielectric Metamaterials: Fundamentals, Designs and Applications links fundamental Mie scattering theory with the latest dielectric metamaterial research, providing a valuable reference for new and experienced researchers in the field. The book begins with a historical, evolving overview of Mie scattering theory. Next, the authors describe how to apply Mie theory to analytically solve the scattering of electromagnetic waves by subwavelength particles. Later chapters focus on Mie resonator-based metamaterials, starting with microwaves where particles are much smaller than the free space wavelengths. In addition, several chapters focus on wave-front engineering using dielectric metasurfaces and the nonlinear optical effects, spontaneous emission manipulation, active devices, and 3D effective media using dielectric metamaterials. Highlights a crucial link in fundamental Mie scattering theory with the latest dielectric metamaterial research spanning materials, design and applications Includes coverage of wave-front engineering and 3D metamaterials Provides computational codes for calculating and simulating Mie resonances

Fundamentals, Designs and Applications

Dielectric Metamaterials

Xiaobing Luo

Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have superior characteristics such as high efficiency, small size, long life, low power consumption, and high reliability. The market for white LED is growing rapidly in various applications. It has been widely accepted that white LEDs will be the fourth illumination source to substitute the incandescent, fluorescent, and high-pressure sodium lamps. With the development of LED chip and packaging technologies, the efficiency of high power white LED will broaden the application markets of LEDs while changing the lighting concepts of our lives. In LED Packaging for Lighting Applications, Professors Liu and Luo cover the full spectrum of design, manufacturing, and testing. Many concepts are proposed for the first time, and readers will benefit from the concurrent engineering and co-design approaches to advanced engineering design of LED products. One of the only books to cover LEDs from package design to manufacturing to testing Focuses on the design of LED packaging and its applications such as road lights Includes design methods and experiences necessary for LED engineers, especially optical and thermal design Introduces novel LED packaging structures and manufacturing processes, such as ASLP Covers reliability considerations, the most challenging problem for the LED industry Provides measurement and testing standards, which are critical for LED development, for both LED and LED fixtures Codes and demonstrations available from the book’s Companion Website This book is ideal for practicing engineers working in design or packaging at LED companies and graduate students preparing for work in industry. This book also provides a helpful introduction for advanced undergraduates, graduates, researchers, lighting designers, and product managers interested in the fundamentals of LED design and production. Color version of selected figures can be found at www.wiley.com/go/liu/led

Design, Manufacturing, and Testing

LED Packaging for Lighting Applications

Sheng Liu

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