Yong Liu

Kangshun Li

This two-volume set, CCIS 2146 and CCIS 2147, constitutes the refereed proceedings of the 14th International Symposium on Intelligence Computation and Applications, ISICA 2023, held in Guangzhou, China, during November 18–19, 2023. The 82 full papers included in these proceedings were carefully reviewed and selected from 178 submissions. The papers presented in these two volumes are organized in the following topical sections: Part I: Frontiers of evolutionary Intelligent Optimization Algorithms; Exploration of computer vision; Machine learning and its applications. Part II: Machine Learning and its applications; Big data analysis and Information security; Intelligent application of computer.

14th International Symposium, ISICA 2023, Guangzhou, China, November 18–19, 2023, Revised Selected Papers, Part II

Intelligence Computation and Applications

Qihui Zhou

Brandon W. Peterson

Huihua Yuan

Biomaterials with the regulation of reactive oxygen/nitrogen species for biomedical applications

Xiang Li

Zhihua Cai

Zhenhua Li

This book constitutes the refereed proceedings of the 6th International Symposium on Intelligence Computation and Applications, ISICA 2012, held in Wuhan, China, in October 2012. The 72 revised full papers presented were carefully reviewed and selected from numerous submissions. The papers are organized in topical sections on artificial life, adaptive behavior, agents, and ant colony optimization; combinatorial and numerical optimization; communications and computer networks; data mining; evolutionary multi-objective and dynamic optimization; intelligent computation, intelligent learning systems; neural networks; real-world applications.

6th International Symposium, ISICA 2012, Wuhan, China, October 27-28, 2012. Proceedings

Computational Intelligence and Intelligent Systems

Jelena Mirkovic

This book constitutes the refereed proceedings of the 16th International Conference on Passive and Active Measurement, PAM 2015, held in New York, NY, USA, in March 2015. The 27 full papers presented were carefully reviewed and selected from 100 submissions. The papers have been organized in the following topical sections: DNS and Routing, Mobile and Cellular, IPv6, Internet-Wide, Web and Peer-to-Peer, Wireless and Embedded, and Software Defined Networking.

16th International Conference, PAM 2015, New York, NY, USA, March 19-20, 2015, Proceedings

Passive and Active Measurement

Hu Peng

Changshou Deng

Zhijian Wu

This book constitutes the thoroughly refereed proceedings of the 10th International Symposium, ISICA 2018, held in Jiujiang, China, in October 2018.The 32 full papers presented were carefully reviewed and selected from 83 submissions. The papers are organized in topical sections on nature-inspired computing; bio-inspired computing; novel operators in evolutionary algorithms; automatic object segmentation and detection; and image colorization; multilingual automatic document classication and translation; knowledge-based articial intelligence; predictive data mining.

10th International Symposium, ISICA 2018, Jiujiang, China, October 13–14, 2018, Revised Selected Papers

Lipo Wang

Liang Zhao

Zhengtao Yu

This book discusses the recent advances in natural computation, fuzzy systems and knowledge discovery. Presenting selected, peer-reviewed papers from the 15th International Conference on Natural Computation, Fuzzy Systems and Knowledge Discovery (ICNC-FSKD 2019), held in Kunming, China, from 20 to 22 July 2019, it is a useful resource for researchers, including professors and graduate students, as well as R&D staff in industry.

Advances in Natural Computation, Fuzzy Systems and Knowledge Discovery

Rong Chen

Jiu Chen

Neuroimaging Biomarkers and Cognition in Alzheimer’s disease Spectrum

Shichun Qu

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.

Analog and Power Semiconductor Applications

Wafer-Level Chip-Scale Packaging

Seeram Ramakrishna

Mohamedazeem M. Mohideen

Kaili Li

Melt Electrospinning: A Green Method to Produce Superfine Fibers introduces the latest results from a leading research group in this area, exploring the structure, equipment polymer properties and spinning conditions of melt electrospinning. Sections introduce the invention of melt electrospinning, including the independent development of centrifugal melt electrospinning and upward melt electrospinning, discuss electro magnetization of melt and the testing method of fiber performance by means of different polymers and self-designed devices, cover simulation, and introduce principle methods and improvement measures of centrifugal melt electrospinning. Presents melt electrospinning, a green nanofiber fabrication technology Introduces the invention of melt electrospinning, including centrifugal melt electrospinning and upward melt electrospinning Describes optimization techniques, electro magnetization of melt, testing methods, DPD simulation and improvement methods Provides a useful introduction to contemporary electrospinning research with a view to its many potential applications

A Green Method to Produce Superfine Fibers

Melt Electrospinning

Shen Liu

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

Manufacturing, Reliability and Testing

Modeling and Simulation for Microelectronic Packaging Assembly

Lishan Kang

This book constitutes the refereed proceedings of the 7th International Conference on Evolvable Systems, ICES 2007, held in Wuhan, China, in September 2007. The 41 revised full papers presented were carefully reviewed and selected from 123 submissions. The papers are organized in topical sections on digital hardware evolution, analog hardware evolution, bio-inspired systems, mechanical hardware evolution, evolutionary design, evolutionary algorithms in hardware design, and hardware implementation of evolutionary algorithms.

7th International Conference, ICES 2007, Wuhan, China, September 21-23, 2007, Proceedings

Evolvable Systems: From Biology to Hardware

Volume 2

Chengyu Hu

Zhuo Kang

Volumes CCIS 107 and LNCS 6382 constitute the proceedings of the 5th International Symposium, ISICA 2010, held in Wuhan, China, in October 2010. ISICA 2010 attracted 267 submissions and through rigorous reviews 53 papers were included in LNCS 6382. The papers are presented in sections on ANT colony and particle swarm optimization, differential evolution, distributed computing, genetic algorithms, multi-agent systems, multi-objective and dynamic optimization, robot intelligence, statistic learning and system design.

5th International Symposium, ISICA 2010, Wuhan, China, October 22-24, 2010, Proceedings

Advances in Computation and Intelligence

Hydrogenated amorphous silicon germanium (a-SiGe:H) films and devices have been extensively studied because of the tunable band gap for matching the solar spectrum and mature the fabrication techniques. a-SiGe:H thin film solar cells have great potential for commercial manufacture because of very low cost and adaptability to large scale manufacturing. Although it has been demonstrated that a-SiGe:H thin films and devices with good quality can be produced successfully, some issues regarding growth chemistry have remained yet unexplored, such as the hydrogen and inert gas dilution, bombardment effect, and chemical annealing, to name a few. The alloying of the SiGe introduces above an order-of-magnitude higher defect density, which degrades the performance of the a-SiGe:H thin film solar cells. This degradation becomes worse when high growth-rate deposition is required. The work presented here uses the Electron-Cyclotron-Resonance Plasma-Enhanced Chemical Vapor Deposition (ECR-PECVD) technique to fabricate a-SiGe:H films and devices with high growth rates. Helium gas, together with small amount of H2, was used as the plasma species. Thickness, optical band gap, conductivity, Urbach energy, mobility-lifetime product, and quantum efficiency were characterized during the process of pursuing good materials. High-quality material was successfully fabricated with the ECR-PECVD technique at high growth rates. The device we made with 1.47 eV band gap has a fill factor of 64.5%. With the graded band gap and graded doping techniques, 70% fill factor was achieved when the band gap was graded from 1.75 to 1.47 eV. We also got 68% fill factor with the band gap graded form 1.75 to 1.38 eV.

High Growth Rate Deposition of Hydrogenated Amorphous Silicon-germanium Films and Devices Using ECR-PECVD

Jin Li

Aniello Castiglione

This book constitutes the refereed proceedings of the 7th International Symposium on Intelligence Computation and Applications, ISICA 2015, held in Guangzhou, China, in November 2015. The 77 revised full papers presented were carefully reviewed and selected from 189 submissions. The papers feature the most up-to-date research in analysis and theory of evolutionary computation, neural network architectures and learning; neuro-dynamics and neuro-engineering; fuzzy logic and control; collective intelligence and hybrid systems; deep learning; knowledge discovery; learning and reasoning.

7th International Symposium, ISICA 2015, Guangzhou, China, November 21-22, 2015, Revised Selected Papers

Hui Wang

Wei Li

This book constitutes the thoroughly refereed proceedings of the 11th International Symposium on Intelligence Computation and Applications, ISICA 2019, held in Guangzhou, China, in November 2019. The 65 papers presented were carefully reviewed and selected from the total of 112 submissions. This volume features the most up-to-date research in evolutionary algorithms, parallel computing and quantum computing, evolutionary multi-objective and dynamic optimization, intelligent multimedia systems, virtualization and AI applications, smart scheduling, intelligent control, big data and cloud computing, deep learning, and hybrid machine learning systems.The papers are organized according to the following topical sections: new frontier in evolutionary algorithms; evolutionary multi-objective and dynamic optimization; intelligent multimedia systems; virtualization and AI applications; smart scheduling; intelligent control; big data and cloud computing; statistical learning.

11th International Symposium, ISICA 2019, Guangzhou, China, November 16–17, 2019, Revised Selected Papers

Artificial Intelligence Algorithms and Applications

Zhangxing Chen

This two-volume set (CCIS 873 and CCIS 874) constitutes the thoroughly refereed proceedings of the 9th International Symposium, ISICA 2017, held in Guangzhou, China, in November 2017.The 101 full papers presented in both volumes were carefully reviewed and selected from 181 submissions. This first volume is organized in topical sections on neural networks and statistical learning: neural architecture search, transfer of knowledge; evolutionary multi-objective and dynamic optimization: optimal control and design, hybrid methods; data mining: association rule learning, data management platforms; Cloud computing and multiagent systems: service models, Cloud engineering; everywhere connectivity: IoT solutions, wireless sensor networks.

9th International Symposium, ISICA 2017, Guangzhou, China, November 18–19, 2017, Revised Selected Papers

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Design, Assembly Process, Reliability and Modeling

Power Electronic Packaging

This book argues that 3D films are becoming more sophisticated in utilising stereoscopic effects for storytelling purposes. Since Avatar (2009), we have seen a 3D revival marked by its integration with new digital technologies. With this book, the author goes beyond exploring 3D’s spectacular graphics and considers how 3D can be used to enhance visual storytelling. The chapters include visual comparisons between 2D and 3D to highlight their respective narrative features; an examination of the narrative tropes and techniques used by contemporary 3D filmmakers; and a discussion of the narrative implications brought by the coexistence of flatness and depth in 3D visuality. In demonstrating 3D cinematic aesthetics and storytelling, Yong Liu analyses popular films such as Hugo (2011), Life of Pi (2012), Gravity (2013), Star Trek Into Darkness (2013, and The Great Gatsby (2013). The book is an investigation into contemporary forms of stereoscopic storytelling derived from a unique, long-existing mode of cinematic illusions.

3D Cinematic Aesthetics and Storytelling

This two-volume set (CCIS 873 and CCIS 874) constitutes the thoroughly refereed proceedings of the 9th International Symposium, ISICA 2017, held in Guangzhou, China, in November 2017. The 101 full papers presented in both volumes were carefully reviewed and selected from 181 submissions. This second volume is organized in topical sections on swarm intelligence: cooperative Search, swarm optimization; complex systems modeling: system dynamic, multimedia simulation; intelligent information systems: information retrieval, e-commerce platforms; artificial intelligence and robotics: query optimization, intelligent engineering; virtualization: motion-based tracking, image recognition.

Yong Liu

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