Zhouping Yin

YongAn Huang

Xiaodong Wan

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.

Modeling and Application of Flexible Electronics Packaging

Hao Wu

Honghai Liu

The three volume set LNAI 10462, LNAI 10463, and LNAI 10464 constitutes the refereed proceedings of the 10th International Conference on Intelligent Robotics and Applications, ICIRA 2017, held in Wuhan, China, in August 2017. The 235 papers presented in the three volumes were carefully reviewed and selected from 310 submissions. The papers in this second volume of the set are organized in topical sections on industrial robot and robot manufacturing; mechanism and parallel robotics; machine and robot vision; robot grasping and control.

YongAn Huang

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