Join Literal
Authors

Author

Electrochemical Society. Electrodeposition Division

Books

Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics II
Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics II
G. S. Mathad, Electrochemical Society. Electrodeposition Division, Electrochemical Society. Dielectric Science and Technology Division

Your next favorite book is out there

Track your reading, share the passages worth remembering, and get recommendations from people you trust — not algorithms. Independent, free, and no ads.

Download on the App Store
... or sign up right here