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Authors
Author
G. S. Mathad
Books
Plasma Etching Processes for Sub-quarter Micron Devices
G. S. Mathad
Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics
G. S. Mathad, Harzara S. Rathore
Thin Film Materials, Processes, and Reliability
Electrochemical Society. Electronics Division, G. S. Mathad
Interconnect and Contact Metallization for ULSI
G. S. Mathad, Hamir Singh Rathore, Harzara S. Rathore, Y. Arita
Proceedings of the Symposium on Highly Selective Dry Etching and Damage Control
G. S. Mathad, Yasuhiro Horiike
Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics II
G. S. Mathad, Electrochemical Society. Electrodeposition Division, Electrochemical Society. Dielectric Science and Technology Division
Copper Interconnects, New Contact Metallurgies, Structures, and Low-k Interlevel Dielectrics
G. S. Mathad